AGARWAL & BHONDVE BUILDCON LLP
LEI number
6488LP6T7UI296M89W52
- Registration status
- Issued
- Next renewal date
- 20 January 2027
- LEI issuer
- Nasdaq CSD SE
Legal entity details
- Registration number
- AAR-2513
- Legal form
- Limited Liability Partnership
- Entity status
- Active
- Legal jurisdiction
- India
- Entity created
- 8 December 2019
- Legal address
- Maharashtra, Sr/179/1, Ganesh Nagar, MIDC Road, Ravet Dehu Road, Pune 412101
- Headquarters address
- Maharashtra, Sr/179/1, Ganesh Nagar, MIDC Road, Ravet Dehu Road, Pune 412101
LEI registration details
- Registration authority
- Companies Register (Ministry of Corporate Affairs)
- Validation sources
- Fully corroborated
- Validation authority
- Companies Register (Ministry of Corporate Affairs)
- Initial registration
- 21 January 2026
- Last updated
- 21 January 2026