NEW GRID BUILDCON LLP
LEI number
984500414863FFF5EB86
- Registration status
- Issued
- Next renewal date
- 9 September 2027
- LEI issuer
- RapidLEI
Legal entity details
- Registration number
- AAC-7846
- Legal form
- Limited Liability Partnership
- Entity status
- Active
- Legal jurisdiction
- India
- Entity created
- 7 October 2014
- Legal address
- CTS 1407, ALMEIDA PARK, BANDRA (WEST), TEMP, 6th ROAD VILLAGE BANDRA, NEAR SOLITAIRE BUILDING, MUMBAI 400050
- Headquarters address
- CTS 1407, ALMEIDA PARK, BANDRA (WEST), TEMP, 6th ROAD VILLAGE BANDRA, NEAR SOLITAIRE BUILDING, MUMBAI 400050
LEI registration details
- Registration authority
- Companies Register (Ministry of Corporate Affairs)
- Validation sources
- Fully corroborated
- Validation authority
- Companies Register (Ministry of Corporate Affairs)
- Initial registration
- 9 September 2024
- Last updated
- 13 July 2026