JAP BUILDCON PRIVATE LIMITED
LEI number
984500DBA0DD054VZA65
- Registration status
- Issued
- Next renewal date
- 10 April 2027
- LEI issuer
- EQS Group GmbH
Legal entity details
- Registration number
- U45400DL2014PTC272794
- Legal form
- Private Limited Company
- Entity status
- Active
- Legal jurisdiction
- India
- Entity created
- 30 October 2014
- Legal address
- A2A/263, GROUND FLOOR JANAK PURI, New Delhi 110058
- Headquarters address
- A2A/263, GROUND FLOOR JANAK PURI, New Delhi 110058
LEI registration details
- Registration authority
- Companies Register (Ministry of Corporate Affairs)
- Validation sources
- Fully corroborated
- Validation authority
- Companies Register (Ministry of Corporate Affairs)
- Initial registration
- 24 January 2022
- Last updated
- 25 February 2026